● The goal of this program is to impart interdisciplinary knowledge across the field of Integrated Circuits & Microsystems Packaging
● Departments Involved: Electrical Engineering, Mechanical and Aerospace Engineering, Materials Science and Metallurgical Engineering
● Curriculum designed in consultation with the industry
● Hands-on training in the state of art design tools and equipment
● Target Industries: Semiconductor Packaging, Design and Fabrication.
● Duration of the course: Four Semesters
Shri Amitesh Kumar Sinha, Joint Secretary, MeitY, Govt. of India
First Industry lecture on "Heterogeneous integration & the role of packaging" by Arun Chandrasekhar @ Intel.
IEEE EPS and IESA jointly host the 1st International workshop on "Advanced Electronics Packaging". To register click here.
Indian Institute of Technology, Hyderabad (IITH) introduced a new interdisciplinary postgraduate engineering program, "Integrated Circuits and Microsystems Packaging (ICMP)". For more info, click here.
The inaugural ‘SemiconIndia 2022’ Conference is being organised by India Semiconductor Mission.For more detail click here.